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METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED OBJECT, METHOD FOR PRODUCING INTERLAYER DIELECTRIC FILM, COVER COAT LAYER, OR SURFACE-PROTECTIVE FILM, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
METHOD FOR PRODUCING POLYIMIDE PRECURSOR, METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED OBJECT, METHOD FOR PRODUCING INTERLAYER DIELECTRIC FILM, COVER COAT LAYER, OR SURFACE-PROTECTIVE FILM, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
A method for producing a polyimide precursor having a structural unit represented by formula (1), the method comprising steps (i) and (ii), the step (i) and/or the step (ii) being conducted in a solvent comprising a compound having both an ether bond and an amide bond. (i) A step in which a carboxylic acid anhydride is reacted with a diamine compound to obtain a polyimide precursor having a structural unit represented by formula (2). (ii) A step in which the polyimide precursor having a structural unit represented by formula (2) is reacted with the compound represented by formula (8) and the resultant reaction product is reacted with a compound represented by formula (9) to obtain a polyimide precursor having a structural unit represented by formula (1). (In formula (1), R1 and/or R2 is a group represented by formula (3).)
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