FLEXIBLE CIRCUIT BOARD SUBSTRATE BASED ON QUANTUM CARBON-BASED FILM AND PREPARATION METHOD THEREFOR

摘要

A flexible circuit board substrate based on a quantum carbon-based film, the substrate comprising a quantum carbon-based film and a PI film formed on the surface of the quantum carbon-based film by means of a chemical vapor deposition (CVD) reaction, and the quantum carbon-based film undergoing plasma modification and having an acrylic acid grafting layer. A method for preparing a flexible circuit board substrate based on a quantum carbon-based film comprises the following steps: performing plasma modification on the surface of a quantum carbon-based film, and using a grafting reaction to generate an acrylic acid grafting layer on the surface of the quantum carbon-based film; and using a CVD method to deposit and form a PI film on the surface of the quantum carbon-based film. A circuit board substrate obtained by depositing a PI thin film on a flexible carbon-based film by using a CVD method has advantages such as controllable thickness, better uniformity and surface flatness, no solvent contamination or interference, and being able to deposit a film on the surface of a complex structure. In addition, a quantum carbon-based film is used instead of a traditional conductor copper foil layer, thus the thermal conductivity and conductivity of the carbon-based circuit board are good, the specific heat is high, heat resistance is good, and reliability is greatly improved.