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MONOLITHIC INTEGRATED CIRCUIT DEVICE HAVING GATE-SINKING pHEMTs

机译:单片集成电路装置,具有栅极沉没的PHEMT

摘要

A monolithic integrated circuit device formed in a multi-layer structure comprises a low-pinch-off-voltage pHEMT and a high-pinch-off-voltage pHEMT. A Schottky layer in the multi-layer structure contains at least three stacked regions of semiconductor material, wherein each of the two adjacent stacked regions differs in material and provides a stacked region contact interface therebetween. The gate-sinking pHEMTs each includes a gate contact, a first gate metal layer, a gate-sinking region, and a gate-sinking bottom boundary. The first gate metal layers are in contact with the topmost stacked region of the Schottky layer. The gate-sinking regions are beneath the first gate metal layers. The gate-sinking bottom boundary of the high-pinch-off-voltage pHEMT, which is closer to the semiconductor substrate than the gate-sinking bottom boundary of the low-pinch-off-voltage pHEMT, locates within 10 Å above or below one of the stacked region contact interfaces of the Schottky layer.
机译:形成在多层结构中的单片集成电路器件包括低夹紧脱离电压PHEMT和高夹紧脱离电压PHEMT。多层结构中的肖特基层包含至少三个半导体材料的堆叠区域,其中两个相邻的堆叠区域中的每一个不同地不同于材料中并且在它们之间提供堆叠区域接触界面。栅极沉没的PHEMT各自包括栅极接触,第一栅极金属层,栅极沉积区域和栅极沉降底界。第一栅极金属层与肖特基层的最顶部堆叠区域接触。栅极吸收区域位于第一栅极金属层下方。高夹出电压PHEMT的栅极沉降底部边界,其比低夹紧脱离电压PHEMT的栅极沉没底部边界更靠近半导体衬底,位于1的10埃内或之下肖特基层的堆叠区域触点接口。

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