DRILLING HOLES WITH MINIMAL TAPER IN CURED SILICONE

摘要

Laser processing systems are used to precisely laser drill holes in an elastomeric material, preferably silicone rubber, to form holes that temporarily support small electronic components while these electronic components are being processed or tested. The hole is formed by inducing a laser pulse from the laser to the upper surface of the elastomeric material in a plurality of passes in a direction from a non-zero inner diameter to a target diameter or from a target diameter to the inner diameter. The plurality of passes form a first pattern so that a continuous one of the plurality of passes overlaps a previous pass of the plurality of passes. Until a hole is formed through the bottom surface of the elastomer material, the first pattern is repeated without changing the direction, or the first pattern is repeated while reversing the directions of the plurality of passes.