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Laser processing device

机译:激光加工装置

摘要

According to one embodiment, a laser processing device includes a light irradiation section, and an optical element. The optical element includes a first transparent member provided via a gap with a tip of the light irradiation section, and a second transparent member. The first transparent member includes a first surface opposed to the tip of the light irradiation section, and a second surface provided so as to be connected to the first surface. The second transparent member includes a flat surface and a convex surface, the flat surface being provided so as to be opposed to the second surface of the first transparent member, the light passed through the first transparent member passing through the convex surface. An optical axis of the laser beam passing through the first surface and an optical axis passing through the convex surface are different from each other.
机译:根据一个实施例,激光处理装置包括光照射部分和光学元件。光学元件包括第一透明构件,第一透明构件通过具有光照射部分的尖端的间隙和第二透明构件提供的间隙。第一透明构件包括与光照射部分的尖端相对的第一表面,以及设置成连接到第一表面的第二表面。第二透明构件包括平坦表面和凸面,平坦表面设置成与第一透明构件的第二表面相对,光通过通过凸面的第一透明构件。穿过第一表面的激光束的光轴和穿过凸面的光轴彼此不同。

著录项

  • 公开/公告号US10946481B2

    专利类型

  • 公开/公告日2021-03-16

    原文格式PDF

  • 申请/专利权人 KABUSHIKI KAISHA TOSHIBA;

    申请/专利号US201715696909

  • 申请日2017-09-06

  • 分类号B23K26/356;B23K26/10;B23K26/06;C21D10;G02B6/26;G02B19;G21C21;

  • 国家 US

  • 入库时间 2022-08-24 17:43:27

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