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Method for measuring oxygen concentration or carbon concentration of single crystal silicon

机译:测量单晶硅氧浓度或碳浓度的方法

摘要

Problem to be solved: to increase the accuracy of repeated measurement in a method of measuring oxygen concentration or oxygen concentration of a test sample wafer cut out from a single crystal silicon ingot using a bandsaw or the like.The method of measuring oxygen concentration or carbon concentration of single crystal silicon isA single crystal silicon ingot is cut in the radial direction to cut the sample waferA sample strip is cut from the sample wafer (S13);The surface of the sample piece is ground (S14) andA step (S17) is provided for measuring the oxygen concentration or carbon concentration of the sample piece after the grinding process.Diagram
机译:要解决的问题:提高使用带状锯等从单晶硅锭切出的测试样品晶片的氧浓度或氧浓度的方法中的重复测量的准确性。在径向方向上切割测量单晶硅ISA单晶硅锭的氧浓度或碳浓度的方法,以切割样品晶片样品条(S13);样品片的表面是研磨的( S14)和A步骤(S17)用于测量研磨过程后样品件的氧浓度或碳浓度.Diagram

著录项

  • 公开/公告号JP2021040006A

    专利类型

  • 公开/公告日2021-03-11

    原文格式PDF

  • 申请/专利权人 株式会社SUMCO;

    申请/专利号JP20190159627

  • 发明设计人 石澤 純一;

    申请日2019-09-02

  • 分类号H01L21/66;C30B29/06;C30B15;

  • 国家 JP

  • 入库时间 2022-08-24 17:40:01

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