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Substrate for electrical circuits and method for producing a substrate of this type

机译:电路基板及其制造这种类型的基材

摘要

A substrate (1, 10) for electrical circuits, comprising at least one metal layer (2,3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2,3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a′, 6a″, 6b′, 6b″) to the metal layer (2,3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a′, 6a″, 6b′,6b″).
机译:电路的基板( 1,10 ),其包含至少一个金属层( 2,3,14,14)和纸陶瓷层( 11 ),其与至少一个金属层( 2,3,14,14)连接面,并且具有顶侧和底侧( 11 / b> a, 11 b ),其中纸陶瓷层( 11 )的形式具有大量的空腔毛孔。特别有利地,通过至少一个胶水层(<)至少一个胶层(<)至少一个金属层( 2,3,14,14)连接到纸陶瓷层( 11 / b>)(< b> 6,6,6 a, 6 ),其通过施加至少一个胶水来产生( 6 ', 6 “, 6 b', 6 b “”金属层( 2,3,14,14)和/或纸陶瓷层( 11 / b>),其中纸陶瓷层中的孔形式的空腔至少通过施加的胶( 6 在表面上至少填充表面', 6 “, 6 b', 6 b “)。

著录项

  • 公开/公告号US10940671B2

    专利类型

  • 公开/公告日2021-03-09

    原文格式PDF

  • 申请/专利权人 ROGERS GERMANY GMBH;

    申请/专利号US201615744349

  • 发明设计人 ANDREAS MEYER;KARSTEN SCHMIDT;

    申请日2016-07-18

  • 分类号B32B9;B32B15/04;B32B15/12;B32B15/20;B32B29;B32B29/08;B32B5/12;B32B5/20;B32B7/12;B32B9/04;B32B9/06;C25D11;C25D11/04;C25D17/12;H01L23/373;H05K1/05;H05K1/02;H05K1/03;H05K3/46;C25D11/08;

  • 国家 US

  • 入库时间 2022-08-24 17:34:44

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