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IC PACKAGE DESIGN AND METHODOLOGY TO COMPENSATE FOR DIE-SUBSTRATE CTE MISMATCH AT REFLOW TEMPERATURES

机译:IC包装设计和方法,以补偿回流温度的模板CTE不匹配

摘要

An IC package including an integrated circuit die having a major surface and one or more solder bumps located on the major surface in at least one corner region of the major surface and a substrate having a surface, the surface including bump pads thereon. The major surface of the integrated circuit die faces the substrate surface, the one or more solder bumps are bonded to individual ones of the bump pads to thereby form a bond joint, the major surface of the integrated circuit die has a footprint area of at least about 400 mm2. A ratio of a coefficient of thermal expansion of the substrate (CTEsub) to a coefficient of thermal expansion of the integrated circuit die (CTEdie) is at least about 3:1. A method of manufacturing an IC package is also disclosed.
机译:包括集成电路管芯的IC封装,该集成电路管芯具有主表面和位于主表面的至少一个角部的主表面上的一个或多个焊料凸块以及具有表面的基板,在其上包括凸块焊盘。集成电路管芯的主表面面向基板表面,一个或多个焊料凸块粘合到各个凸块焊盘上,从而形成键合接头,集成电路管芯的主表面至少具有至少占地面积大约400 mm 2 。基板的热膨胀系数与集成电路管芯的热膨胀系数(CTE die )的比例为至少约3: 1。还公开了一种制造IC包装的方法。

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