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Imprint Mold Substrate, Imprint Mold, and Imprint Mold Substrate Manufacturing Method

机译:压印模具基板,压印模具和压印模具基材制造方法

摘要

PROBLEM TO BE SOLVED: To provide an imprint mold substrate, an imprint mold, and a method for manufacturing an imprint mold substrate having a highly accurate convex structure portion. An imprint mold substrate includes a base portion having a first surface and a second surface facing the first surface, and a convex structure portion protruding from the first surface, and the convex structure portions are first to N (1st to N). It has a substantially N-square-shaped upper surface portion having N ≧ 3) sides and a round-shaped side wall portion connecting the outer periphery of the upper surface portion and the first surface, and is located on the M (1 ≦ M ≦ N) side. The protrusion height HM of the convex structure portion and the length WM between the M side in the plan view from the first surface side and the connecting portion connecting the side wall portion and the first surface are expressed in the equation (1). Has the relationship shown. −0.1HM ≦ HM −WM ≦ 0.1HM ・ ・ ・ (1) [Selection diagram] FIG. 1A
机译:要解决的问题:提供压印模具基板,压印模具和制造具有高精度凸面结构部分的压印模具基板的方法。压印模具基板包括具有第一表面的基部和面向第一表面的第二表面,以及从第一表面突出的凸起结构部分,并且凸形结构部分首先是N(1至N)。它具有基本上正方形的上表面部分,其具有n≥3)侧和连接上表面部分和第一表面的外周的圆形侧壁部分,并且位于M(1≤m ≤n)侧。凸起结构部分的突出高度Hm和从第一表面侧的平面图中的M侧和连接侧壁部分的连接部分和第一表面之间的长度为连接部分,并且在等式(1)中表示。有关系显示。 -0.1hm≤hm-wm≤0.1hm··(1)[选择图] 1A

著录项

  • 公开/公告号JP2021034457A

    专利类型

  • 公开/公告日2021-03-01

    原文格式PDF

  • 申请/专利权人 大日本印刷株式会社;

    申请/专利号JP20190150713

  • 发明设计人 中田 尚子;大川 泰央;

    申请日2019-08-20

  • 分类号H01L21/027;B29C33/38;B29C59/02;

  • 国家 JP

  • 入库时间 2022-08-24 17:24:47

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