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Substrate conveying mechanism of vapor phase growth apparatus

机译:气相生长装置的基板输送机构

摘要

Problem to be solved: to provide a substrate transport mechanism of a vapor phase growth apparatus in which semiconductor yield is good without preventing uniform film formation of semiconductor crystals.Substrate transport mechanism of vapor phase growth apparatusA substrate table 17 for covering a circular hole portion is provided at the substrate delivery position of the susceptorAbove the substrate delivery positionHaving a plurality of claw portions 19A capable of supporting the outer periphery of the substrateUpper and lower upper chuck with upper and lower cylindersUnder the substrate delivery positionHold the board mount from belowIt comprises a lower chuck which can be moved up and down by a lower lift cylinder.Substrate support 17 isA base part 17a having a larger diameter than a circular hole portion andProtruding above the baseA cylindrical platform having a diameter corresponding to the substrate;At the position corresponding to claw portion 19A of upper chuckA mounting portion 17b having a cutting part 17D having a side cut off the side of the cylinder andProtruding below the baseA cylindrical portion 17c having a smaller outer diameter than the circular hole portion is providedDiagram
机译:要解决的问题:提供一种气相生长装置的基材传输机制,其中半导体产率良好而不防止半导体晶体的均匀成膜。用于覆盖圆孔部分的汽相生长设备的基板传送机构覆盖圆孔部分的基板输送位置,该基板输送位置位置位置能够支撑基本泵的外周和下上部卡盘的多个爪部分19a具有上下圆柱体下方的基板递送位置位置,从下面的板安装件包括下夹盘,其可以通过下升降缸上下移动。安装支撑件17 isa基部17a,其具有比圆形孔部分更大直径的基部17a和圆形孔部分。底圆平台具有与基板对应的直径;在对应于上卡盘安装部分17b的爪部19a的位置,具有切割部分17d,该切削部分17d具有侧面切断的圆柱侧的侧面,并且在底圆柱部分17c下方具有较小的圆柱形部分17c。外径比圆形孔部分为p r图表

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