PLATING BRIGHT COPPER DEPOSITS WITH PERIODIC REVERSE CURRENT

• 1. 高镍铜阳极采用周期性反向电流电解的工艺 [P] . 中国专利： CN113652716A . 2021-11-16
• 2. 酸性铜电镀浴以及用于电镀低内应力和优良延展性的铜沉积物的方法 [P] . 中国专利： CN106521571A . 2017-03-22
• 3. ADDITIVE FOR PR PULSE ELECTROLYTIC COPPER PLATING, AND COPPER PLATING LIQUID FOR PERIODIC REVERSE PULSE ELECTROLYTIC PLATING [P] . 日本专利： JP2010189733A . 2010-09-02

  机译： 用于PR脉冲电解铜镀覆的添加剂，以及用于周期性反向脉冲电解镀覆的铜镀液

• 4. Electroless copper plating soln. - giving copper deposit of bright metallic appearance and improved ductility [P] . 德国专利： DE2632920C3 . 1979-04-19

  机译： 化学镀铜溶液。 -使铜沉积物具有明亮的金属外观并改善延展性

• 5. Electroless copper plating soln. - giving copper deposit of bright metallic appearance and improved ductility [P] . 德国专利： DE2632920A1 . 1978-01-26

  机译： 化学镀铜溶液。 -使铜沉积物具有明亮的金属外观并改善延展性

• 1. Electroless Plating Lead and Lead-Tin on Copper Using an Eco-Friendly Plating Bath [J] . A. B. Abdel-Aziz, M. M. B. El-Sabbah, I. M. Ghayad, 材料科学与应用期刊（英文） . 2020,第012期
• 2. Electroless copper plating process of N, N, N, N′-tetrakis (2-hydroxypropyl) ethylenediamine system with high plating rate [J] . ZHENG Ya-jie, ZOU Wei-hong, YI Dan-qing, 中南大学学报（英文版） . 2005,第0z1期
• 3. Is Periodic Pulse Reverse the right copper plating for your PCB manufacturing? [C] . George Milad, Mark Lefebvre AESF International Pulse Plating Symposium . 2001
• 4. MECHANISM OF BRIGHT ELECTROPLATING: LAMINATIONS AND PERIODICITY IN THE DEPOSITION OF NICKEL AND COPPER. [D] . VANDERKOOI, NICHOLAS, JR. -1
• 5. High resolution mass spectral data from the analysis of copper chlorophylls and copper chlorophyll degradation products in bright green table olives [O] . Peter F. Scholl, Patrick J. Gray, Bhakti Petigara Harp, 2020
• 6. Effect of Direct Current, Pulsed Current and Periodic Reverse Current Electrolysis Conditions on the Internal Strain in Cobalt Deposit [O] . Masaaki YANO, Yutaka TSURU 2017
• 7. The Preparation and Characterization of Direct Current and Asymmetric Periodic Reverse Current Electrodeposits of Epitaxial Copper [R] . O'Connor, J. J., Rubin, B., Spector, R. 1966

• 1. Composition and Morphology of Zn-Co Alloy Coatings Deposited by Means of Pulse Plating Containing Reverse Current [J] . 费敬银 . 武汉理工大学学报：材料科学英文版 . 2007,第3期
• 2. Morphology and tribological properties of Ni/n-SiO_2 composite coatings by pulse-reverse current brush-plating [J] . 谭俊 ,郭文才 ,杨红军 . 中南大学学报：英文版 . 2005,第S2期
• 3. Effect of direct current and pulse plating on the EDM performance of copper-zirconium diboride composites [J] . . 矿物冶金与材料学报 . 2007,第005期
• 4. 铜的周期反向电流电解的实践与探讨 [C] . 马朝庆 . 中国有色金属学会首届青年学术年会 . 1994
• 5. 人工流产术后即刻放置曼月乐与含铜节育器的临床效果分析 [A] . 剧蕴慧 . 2015