首页> 外国专利> Improvements in or relating to processes and apparatus for the production of semi-conductor crystals

Improvements in or relating to processes and apparatus for the production of semi-conductor crystals

机译:半导体晶体生产工艺和设备或与之相关的改进

摘要

866,199. Semi-conductors. STE1VIENS & HALSKE A.G. Aug. 12, 1957 [Aug. 10, 1956], No. 25391/57. Class 37. A process for incorporating a doping substance into a semi-conductor melt comprises passing the substance in gaseous form from a storage vessel in which the substance is under pressure through a capillary nozzle into a stream of carrier gas consisting of hydrogen or of other gas inert to the doping substance and to the semi-conductor melt and wherein said substance is conducted together with said carrier gas to a treatment vessel in which the melt is located. The crystal 3 is heated in a reaction chamber to melt it. The doping substance may be BCl a and is contained in a storage vessel 6. The crystal may be of Si or Ge or of a compound of two or more different metals, the hydrogen can be replaced by a rare gas and any other boron halide such as the bromide BBr 3 can be used. The incorporation of the impurity or " doping " is to give the crystal a particular resistivity to increase the life of the charge carriers or to produce a crystal of a particular conductivity type, and the doping substance is generally distributed uniformly over the surface. In the particular process described the silicon crystal 3 is zone-melted, that is, successive zones of a vertically moving crystal are melted by a high-frequency coil 4. The proportions of carrier gas and "impurity gas" can be adjusted by the pressure in 6, by adjusting the size of the capillary nozzle, e.g. by a needle valve, and by adjusting the rate of flow of the hydrogen or other carrier gas. The final " doped " crystals have accurately-reproducible resistivities over a wide range, e.g. between 1 and 50 ohms/em. In a modification, crystal 3 can be melted in a crucible. In an example a silicon crystal with 10 atoms per cent of boron gives a resistivity of 10 ohms/cm. Prior art methods comprising the steps of conducting hydrogen or a rare gas over a heated liquid halide or mixing the carrier gas with halide gas and then reducing the proportion of the halide by freezing, are referred to.
机译:866,199。半导体。 STE1VIENS&HALSKE A.G.,1957年8月12日[Aug. 1956年10月],第25391/57号。 37类。一种将掺杂物质掺入半导体熔体中的方法,包括将气体形式的物质从储存容器中通过毛细管喷嘴进入处于压力下的储存容器,该储存容器中的气体由氢气或其他气体组成对掺杂物质和半导体熔体呈惰性的气体,其中所述物质与所述载气一起被引导至处理容器,熔体位于该处理容器中。在反应室中加热晶体3以使其熔融。掺杂物质可以是BCl a,并包含在储存容器6中。晶体可以是Si或Ge或两种或多种不同金属的化合物,氢可以用稀有气体和任何其他卤化硼代替。因为可以使用溴化物BBr 3。掺入杂质或“掺杂”是为了赋予晶体特定的电阻率以增加电荷载流子的寿命或产生特定导电类型的晶体,并且掺杂物质通常均匀地分布在表面上。在所述的特定过程中,硅晶体3被区域熔化,即,垂直移动的晶体的连续区域被高频线圈4熔化。载气和“杂质气体”的比例可以通过压力来调节。在图6中,通过调节毛细管喷嘴的尺寸,例如通过针阀,并通过调节氢气或其他载气的流速。最终的“掺杂”晶体在很宽的范围内具有可精确再现的电阻率,例如在1至50欧姆/ em之间。在一个变型中,晶体3可以在坩埚中熔化。在一个示例中,硼原子百分比为10的硅晶体的电阻率为10 ohms / cm。涉及现有技术的方法,该方法包括以下步骤:在加热的液态卤化物上传导氢或稀有气体,或者将载气与卤化物气体混合,然后通过冷冻降低卤化物的比例。

著录项

  • 公开/公告号GB866199A

    专利类型

  • 公开/公告日1961-04-26

    原文格式PDF

  • 申请/专利权人 SIEMENS & HALSKE AKTIENGESELLSCHAFT;

    申请/专利号GB19570025391

  • 发明设计人

    申请日1957-08-12

  • 分类号C30B13/12;

  • 国家 GB

  • 入库时间 2022-08-23 18:21:48

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号