Method of formation of a boss of the ohmic contact by electrolytic deposition on a block of semi conducting -

摘要

An ohmic contact bump, e.g. of Ag, Au, Cu, Ni or Co, is electroplated upon a semi-conductor body, e.g. of Si or Ge and preferably through apertures in a protective SiO2 mask thereon, in a plating bath into which ultrasonic energy is introduced. The D.C. may be increased in steps during plating.