RESIN ENCAPSULATED,COMPRESSION BONDED,DISC-TYPE SEMICONDUCTOR DEVICE

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• 2. 压接型半导体器件、压接子模块以及弹性测温封装组件 [P] . 中国专利： CN111912538A . 2020-11-10
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  机译： 半导体装置的树脂包封方法及压缩成型树脂包封装置

• 4. Plural semiconductor devices bonded onto one face of a single circuit board for subsequent batch resin encapsulation of the plural semiconductor devices in a single cavity formed by molding dies [P] . 美国专利： US6676885B2 . 2004-01-13

  机译： 将多个半导体器件接合到单个电路板的一个面上，以随后将多个半导体器件批量树脂封装在通过模制形成的单个腔体中

• 5. SEMICONDUCTOR ELEMENT FOR COMPRESSION BONDED ENCAPSULATED ELECTRICAL DEVICES [P] . CA881786A . 1971-09-21

  机译： 压缩粘合封装电气设备的半导体元件

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