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A process for the connection of the pseudo alloy of tungsten - copper with electrolytic copper and application of the method

机译:钨铜假合金与电解铜的连接工艺及其应用。

摘要

W-Cu pseudo-alloys esp. ctg. 60-90% W, are impregnated electrolytically with Cu and A Cu layer of thickness 0.2-0.5 mm deposited. The material is then heated at 1000-1300 degrees C in an inert/reducing atmos esp. 75 vol.% H2 and 25 vol.% N2 or alternatively pure H2, until the black line which forms at the alloy/Cu junction when the m.pt. of Cu is reached, has disappeared. Pref. the material is allowed to cool immersed in alumina which has been pre-heated to 100 C and also in a H2-free atmos. The material is esp. suited for contacts of high voltage electrical appts and has excellent-wear and erosion resistance.
机译:W-Cu伪合金,特别是ctg。电解浸渍60-90%W的Cu,并沉积0.2-0.5 mm的Cu层。然后将材料在惰性/还原气氛尤其是1000-1300摄氏度下加热。 H2的含量为75%(体积),N2的含量为25%(体积),或者纯H2,直到当m.pt处在合金/ Cu结处形成黑线为止。铜达到,已消失。首选将材料冷却后浸入已预热至100°C的氧化铝中,然后浸入无H2的气氛中。材料特别是。适用于高压电器的触点,具有出色的耐磨性和耐腐蚀性能。

著录项

  • 公开/公告号DE2259958A1

    专利类型

  • 公开/公告日1973-06-14

    原文格式PDF

  • 申请/专利权人 ENERGOINVEST PREDUZECE ZA PROJ;

    申请/专利号DE19722259958

  • 发明设计人 RIZO BUSCHATLIJA;

    申请日1972-12-07

  • 分类号C22C1/02;

  • 国家 DE

  • 入库时间 2022-08-23 06:48:43

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