首页> 外国专利> MAGNETIC CORE CIRCUIT FOR TESTING ELECTRICAL SHORT CIRCUITS BETWEEN LEADS OF A MULTI-LEAD CIRCUIT PACKAGE

MAGNETIC CORE CIRCUIT FOR TESTING ELECTRICAL SHORT CIRCUITS BETWEEN LEADS OF A MULTI-LEAD CIRCUIT PACKAGE

机译:磁芯电路,用于测试多引线电路封装的引线之间的电气短路

摘要

A voltage is induced in at least one lead of a multi-lead package for an electronic circuit by one or more excitation cores disposed around one or more leads of the package. The leads are connected together at one end by the lead frame. The opposite ends of the leads are secured to a housing for the electronic circuit. One or more detection cores, disposed around one or more leads of the package and suitably spaced from the excitation cores, detect current in the lead circuit encompassed by the excitation and detection cores. A relatively high voltage is induced in the detection cores if a short circuit exists in the encompassed lead circuit while a relatively low voltage is induced in the detection cores if an open circuit is detected.
机译:通过围绕封装的一根或多根引线布置的一个或多个励磁芯,在用于电子电路的多引线封装的至少一根引线中感应出电压。引线通过引线框架在一端连接在一起。引线的相对端固定到用于电子电路的壳体。围绕封装的一根或多根引线布置并与激励芯适当间隔的一个或多个检测芯,检测由激励和检测芯包围的引线电路中的电流。如果所包围的引线电路中存在短路,则在检测芯中感应出相对高的电压,而如果检测到开路,则在检测芯中感应出相对低的电压。

著录项

  • 公开/公告号US3719883A

    专利类型

  • 公开/公告日1973-03-06

    原文格式PDF

  • 申请/专利权人 NORTH AMERICAN ROCKWELL CORPUS;

    申请/专利号USD3719883

  • 发明设计人 PENTECOST EUS;

    申请日1970-09-28

  • 分类号G01R31/02;

  • 国家 US

  • 入库时间 2022-08-23 06:31:04

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号