Butadiene monoxide and ethylene glycol reaction prods. - as additives in bright copper plating baths

摘要

New 2-(2-hydroxyethoxy)-3-buten-1-ol nIII) and 1,2-di-(1-hydroxy-3-buten-2-oxy)-ethane (IV) are prepd. by (a) allowing butadiene monoxide (I) to reat, at 0-40 degrees C with excess ethylene glycol (II), in mol. ratio of (I):(II) of 1:2 to 1:10 (1:3 to 1:6) in the presence of acid catalysts, to form (III) and (b) further reaction of (I), under the same reaction conditions, with (III) obtd. in a mole ratio of (I):(III) of 1:2 to 1:10 (1:3 to 1:6) to form (IV). (III) and (IV) are used as additives in acid Cu electrodeposition baths, in concns. of 0.1-10(0.5-2)g/l. (II) and (IV) are obtd. in high yields. Their addn. to Cu electroplating baths improve bath efficiency and the working time can be prolonged up to the onset of first cloudiness, which sets in later, thereby delaying filtration and saving filter renewal costs.