ELECTRODEPOSITION OF NICKEL COBALT AND ALLOYS WITH ONE ANOTHER AND WITH IRON

摘要

1411535 Electro-depositing nickel/cobalt with or without iron M & T CHEMICALS Inc 22 April 1974 [23 April 1973] 17567/74 Heading C7B Ni and/or Co with or without Fe is electrodeposited from an aqueous acidic plating solution containing at least one Ni and/or Co compound, e.g. sulphate or sulphamate and/or chloride, optionally at least one ferrous compound e.g. sulphate and/or chloride, and boric acid, without precipitation of basic ferric salts, by adding to the solution 2 to 100 g/l of mannitol, sorbitol and/or dulcitol. The solution may also contain at least one (a) primary brightener, (b) secondary brightener, (c) secondary auxiliary brightener, (d) antipitting agent: such as (a) reaction products of epoxides with -hydroxy acetylenic alcohols (diethoxylated or dipropoxylated 2-butyne-1,4- diol), other acetylenics, N-heterocyclics, active S compounds and dyestuffs, e.g. 1,4-di-(#-hydroxyethoxy or propoxy) -2-butyne, 1,4-di-(#-hydroxy- -chloropropoxy)-2-butyne, 1,4-di-(#--epoxyproxy)-2-butyne, 1 ,4-di-(#-hydroxy--butenoxy)-2- butyne, 1,4-di-(2SP1/SP-hydroxy-4SP1/SP-oxa-6SP1/SP-heptenoxy)- 2-butyne, N-1,2-dichloropropeayl pyridinium chloride, 2,4,6-trimethyl N-propargyl pyridinium bromide, N-allyl quinaldinium bromide, 2-butyne- 1,4-diol, propargyl alcohol, 2-methyl-3-butyn-2-ol, thiodiproprionitrile, thiourea, phenosufranin, fuchsin; (b) aromatic sulphonates, sulphonamides, sulphonimides and sulphinates, e.g. saccharin or Na saccharinate, trisodium 1,3,6-naphthalene trisulphonate, sodium benzene monosulphonate or monosulphinate, dibenzene sulphonimide; (c) (aromatic-) aliphatic olefinically or acetylenically unsaturated sulphonates, sulphonamides or sulphonimides, e.g. sodium allyl sulphonate, sodium-3-chloro-2-butene-1-sulphonate, sodium #- styrene sulphonate, sodium propargyl sulphonate, monoallyl or diallyl sulphamide, allyl sulphonamide, or Zn, Cd or Se compounds; (d) sodium lauryl (ether) sulphate or sodium di-alkylsulphosuccinate. The substrate may be of Ni, Co, Ni-Co, Cu, Sn, brass, steel, Cu-Pb or Cu-Sn alloy, Zn (base die casting), which may be Cu plated. The anodes may be of the metal(s) to be electrodeposited, preferably suspended as bars, strips or chunks in Ti baskets, covered with cloth or plastics bags.