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METHOD OF ENCAPSULATING END-CONTACTED ELECTRICAL COMPONENTS

机译:包封末端受电组件的方法

摘要

A method of encapsulating an end contacted electrical component, provided with connecting wires, with a continuous layer of synthetic resin material serving as insulation and protection, by a vortex sintering process by attaching a metal foil to the component or wrapping the component with a metal foil or a metalized synthetic resin foil with the metalization facing outwardly, in such a manner that no electrical contact is formed between the end contacts and thereafter placing the wrapped component in a reservoir containing a suspended synthetic resin powder maintained in a turbulent motion and heating the component indirectly by inductance using high frequency current so as to fuse or sinter resin powder deposited on the component to form the synthetic resin layer, the heating being conducted only after the component has been placed in the reservoir.
机译:一种通过将金属箔附着在部件上或用金属箔包裹部件的涡流烧结工艺,对设置有连接线的末端接触电气部件进行密封的方法,该部件具有一层连续的合成树脂材料作为绝缘和保护层或金属化的合成树脂箔,其金属化面向外,以使得在端部触点之间不形成电接触,然后将包裹的组件放入包含悬浮液的合成树脂粉末的容器中,该粉末保持紊流并加热该组件通过使用高频电流的电感间接地熔合或烧结沉积在部件上的树脂粉末以形成合成树脂层,仅在将部件放置在容器中之后才进行加热。

著录项

  • 公开/公告号ES418373A1

    专利类型

  • 公开/公告日1976-03-16

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号ES19730418373

  • 发明设计人

    申请日1973-08-31

  • 分类号H01G;

  • 国家 ES

  • 入库时间 2022-08-23 02:29:22

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