首页> 外国专利> Electrodeposition of metals esp. copper - using hydrogen anode out of contact with metal contg. electrolyte, to prevent fouling of anode

Electrodeposition of metals esp. copper - using hydrogen anode out of contact with metal contg. electrolyte, to prevent fouling of anode

机译:金属的电沉积,特别是铜-使用氢阳极不与金属接触。电解液,防止阳极结垢

摘要

Metals having a lower oxidation potential than hydrogen therefore reducible by hydrogen from solutions of their acid salts are electrodeposited from thin salts using a hydrogen anode having its catalytic surface in ionic contact with the solution but out of physical contact with it. The hydrogen is passed along the catalytic surface so that the metal of the solution is reduced to the element on a conductive surface in the soln.
机译:因此,使用氢阳极使氢从其酸盐溶液中被氢还原的氧化电位比氢低的金属,该氢阳极的催化表面与溶液发生离子接触但不与溶液物理接触,而由稀盐进行电沉积。氢沿着催化表面通过,从而使溶液中的金属还原为soln中导电表面上的元素。

著录项

  • 公开/公告号FR2252416B3

    专利类型

  • 公开/公告日1976-10-01

    原文格式PDF

  • 申请/专利权人 PROTOTECH;

    申请/专利号FR19730041559

  • 发明设计人

    申请日1973-11-22

  • 分类号C25C1/00;C25C1/12;C25C1/20;

  • 国家 FR

  • 入库时间 2022-08-23 01:52:44

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