POLISHING ETCH FOR MONOCRYSTALS OF MERCURY-CADMIUM-TELLURIUM TRIPLE SOLID SOLUTIONS

• 1. 一种碲锌镉基碲镉汞薄膜的磨抛损伤测试方法 [P] . 中国专利： CN106546619A . 2017-03-29
• 2. 掺锑、砷新型碲镉汞改性化合物及其单晶与薄膜材料 [P] . 中国专利： CN1858307A . 2006-11-08
• 3. Production manner and all the factor solid solution die piezoelectric monocrystal ingots, and piezoelectric monocrystal component null Bridgman modulo of all the factor solid solution [P] . 日本专利： JP4878607B2 . 2012-02-15

  机译： 生产方式和所有因子固溶体均模压压电单晶锭，且压电单晶成分为所有因子固溶体的零布里奇曼模

• 4. ETCHING AGENT FOR PRECISION CHEMICAL POLISHING OF GALLIUM ANTIMONIDE MONOCRYSTALS AND GALLIUM ANTIMONIDE-BASE SOLID SOLUTIONS [P] . SU1135382A1 . 1986-10-15

  机译： 精密化学抛光镓锑化物和镓氨基化物基固溶体的蚀刻剂

• 5. New type phase of restricted solid solution in the triple system of vanadium, ytterbium and yttrium oxides and method for producing new type phase of restricted solid solution in the triple system of vanadium, ytterbium and yttrium oxides [P] . PL235461B1 . 2020-08-10

  机译： 钒，，氧化钇三元体系中新型固溶体相及新型固溶方法

• 1. Microscopic model for chemical etchability along radiation damage paths in solids [J] . Mukhtar Ahmed RANA 核技术（英文版） . 2008,第003期
• 2. ETCH “sandbox”: Controlled release dimensions through atomic layer deposition etch stop with trench refill and polish [C] . Winterkorn M.M., Dadlani A.L., Kim Y., International Conference on Solid-State Sensors, Actuators and Microsystems . 2015
• 3. An assessment of the design of a polishing pond system with respect to total suspended solids. [D] . Gulley, Zoe. 2008
• 4. Torque Analysis of a Triple Acid-Etched Titanium Implant Surface [O] . Ana Emília Farias Pontes, Cássio Torres de Toledo, Valdir Gouveia Garcia, 2015
• 5. The Observation of Dislocations in the Cu-Al alpha; Solid Solution by Etch Pits [O] . Shozo Yoshioka, Yutaka Nakayama, Taichiro Ito 1965

• 1. Comparison of Complications Following Implant-Based Breast Reconstruction Using Triple Antibiotic Solution versus Low Concentration Chlorhexidine Gluconate Solution [J] . Tyler K. Merceron ,Udayan Betarbet ,Alexandra Hart . 现代整形外科（英文） . 2019,第4期
• 2. Effects of HNO_3 concentration on the pit morphologies of aluminum foil etched in HNO_3–HCl and HNO_3–H_2SO_4–HCl solutions [J] . Quan-xiu Yi ,Ye-dong He ,Ning Peng . 矿物冶金与材料学报：英文版 . 2016,第1期
• 3. Growth and passivation of aluminum etch tunnels at on-off controlling direct current in 6 wt. HCI solution [J] . WANG Mei HE Yedong . 稀有金属：英文版 . 2008,第2期
• 4. Corrosion electrochemical mechanism of chemical mechanical polishing of copper in K_3Fe(CN)_6 solution [J] . 何捍卫 ,胡岳华 ,黄可龙 . 中国有色金属学会会刊：英文版 . 2002,第1期
• 5. 磨抛工艺中碲镉汞晶片的表面损伤和测量 [C] . 姚英 . 中国有色金属学会1993年砷化镓及有关化合物会议 . 1993
• 6. 碲镉汞中红外光电探测器阵列温度标定方法研究 [A] . 安晏阳 . 2020