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Solderability tester which lowers PCB into solder bath - is used to measure time for solder to rise in holes

机译:可焊性测试仪,可将PCB降低到焊锡槽中-用于测量焊锡在孔中上升的时间

摘要

The solderability tester measures the ease with which the metal surfaces of a PCB can be soldered by measuring the time for solder to rise through metal-coated holes in the board. The board (10) is supported above the solder bath (14) and lowered into it in clearly defined steps. A pointed probe (18) is mounted in the hole and is connected to an instrument (20) that shows when the solder touches the tip of the probe. The time between lowering the board and selder/probe contact being established gives the rate at which solder 'tins' the metal surface.
机译:可焊性测试仪通过测量焊料从板上金属涂层的孔中上升的时间来测量PCB的金属表面焊接的难易程度。板(10)被支撑在焊料浴(14)上方,并以明确的步骤降低到其中。尖头探针(18)安装在孔中,并与仪器(20)连接,该仪器显示焊料何时接触探针的尖端。降低板与建立焊锡/探针接触之间的时间给出了焊料“锡”金属表面的速率。

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