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Solderability tester which lowers PCB into solder bath - is used to measure time for solder to rise in holes
Solderability tester which lowers PCB into solder bath - is used to measure time for solder to rise in holes
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机译:可焊性测试仪,可将PCB降低到焊锡槽中-用于测量焊锡在孔中上升的时间
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摘要
The solderability tester measures the ease with which the metal surfaces of a PCB can be soldered by measuring the time for solder to rise through metal-coated holes in the board. The board (10) is supported above the solder bath (14) and lowered into it in clearly defined steps. A pointed probe (18) is mounted in the hole and is connected to an instrument (20) that shows when the solder touches the tip of the probe. The time between lowering the board and selder/probe contact being established gives the rate at which solder 'tins' the metal surface.
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