Learning algorithms for both real-time detection of solder shorts and for SPC measurement correction using cross-sectional x-ray images of PCBA solder joints

摘要

Abstract: Learning algorithms are introduced for use in the inspection of cross-sectional X-ray images of solder joints. These learning algorithms improve measurement accuracy by accounting for localized shading effects that can occur when inspecting double- sided printed circuit board assemblies. Two specific examples are discussed. The first is an algorithm for detection of solder short defects. The second algorithm utilizes learning to generate more accurate statistical process control measurements. !0