A soldering nozzle for delivering molten solder to the lower surface of the PCB, a method for reducing the degree of occurrence of dewetting of the solder nozzle

摘要

The present invention provides an improved soldering nozzle (61) for delivering molten solder to the underside of a PCB. The nozzle (61) comprises a nozzle outlet , the nozzle (61) having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61) having an outer surface configured to collect a return flow of molten solder. The nozzle (61) is adapted to release excess molten solder by having defined therein at least one aperture through which an excess of molten solder can be released.