Contacting semiconductor, esp. integrated circuit - using ribbon with rounded or tapered fingers and avoiding short circuiting on encapsulation

摘要

Contacting of semiconductor elements, esp. integrated circuits, with an electrically conductive ribbon with fine structures of individual fingers corresp. to the number of electrical leads is carried out in such a way that short circuits are avoided. The elements are placed in the centre of the ribbon and the leads are taken from the free ends of the fingers to the contact points by thin metal wires. After contacting, the assembly is encapsulated with a drop of plastics (I) by spraying. The novelty comprises the use of ribbon in which the critical edges of the fingers tending to short circuit with the contact wires on spraying are removed, taking the wires to the contacts so that these form a slight arc in the spraying direction and spraying with (I) of low viscosity. Yield stability of electrical parameters and reliability in operation are improved. (I) esp. on epoxy resin.