Combined semiconductor device-printed circuit board - with semiconductor device requiring fewer connections and less space in layout of board

摘要

Circuit assembly comprises a printed circuit board with a transverse opening surrounded by spaced connecting points for the conductive paths of the circuit board, and a holder for a semiconductor device which has the same size and shape as the opening and which has a surrounding wall for insertion of the semiconductor device. The latter has flat upper and lower surfaces, terminals of a microelectronic circuit in its upper surface, and a thickness far smaller than the length or width of its upper surface. Means are provided for connecting the terminals of the semiconductor device to those of the printed circuit, and are covered together with the semiconductor device and the free upper parts of the holder by a sealing cpd., pref. epoxy material which is applied in liquid form and allowed to cure.