Semiconductor component with two liq. cooled pressure plates - has heat sink with coolant flow channel in closure compression contact with plates

摘要

The semiconductor component contains at least one disc-shaped element, such as a thyristor, or a diode. The element (s) is held resiliently between two pressure plates (2, 3) which are exposed to liquid cooling. The pressure plates are forced against a heat sink (11) which has flow channels (11a) for the liquid coolant. If the pressure plates are used for current conduction a layer (17) of electrically insulating, but thermally conductive, material is inserted between each pressure plate and the heat sink. The compression of the pressure plate against the heat sink is preferably provided by a leaf spring (12) screwed to the heat sink. Between the leaf spring and each plate may be inserted a spherical pressure member (15, 16).