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opto-electronic contactless position detecting of integrated circuits - involves scanning chip scanned in lines, and brightness values are integrated and differences formed

机译:集成电路的光电非接触式位置检测-涉及以行扫描的扫描芯片,亮度值被积分并形成差

摘要

The detection is independent from pattern and surface properties, in automatic and is intended for adjustment of automatic wiring machines, and for chip transfer to alloying and glueing machines. The position of the chip is found by scanning in lines over the system straight edge, with the lines parallel or nearly so to the direction of the wanted edge (4, 5). The instantaneous brightness intensity is integrated over the lines and differences between line results formed. Only their polarities are used. The result is weighted, reducing the differences in a coarse area, and intensifying them in smooth areas. A signal is derived for the chip position correction.
机译:该检测独立于图案和表面特性,是自动的,适用于自动布线机的调整以及将切屑转移到合金化和涂胶机上。芯片的位置是通过在系统直线边缘上的线中扫描而找到的,这些线平行于或接近于所需边缘的方向(4,5)。瞬时亮度强度在线上积分,并且线结果之间形成差异。仅使用其极性。对结果进行加权,以减少粗糙区域中的差异,并在平滑区域中加大差异。导出用于芯片位置校正的信号。

著录项

  • 公开/公告号DE2816324A1

    专利类型

  • 公开/公告日1979-10-18

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE19782816324

  • 发明设计人 DOEMENSGUENTERDR.;

    申请日1978-04-14

  • 分类号H01L21/68;G01D21/04;H04N7/18;G06K9/00;

  • 国家 DE

  • 入库时间 2022-08-22 19:45:52

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