Perforated plastics tape for mfr. of semiconductor elements - is a laminate comprising a base stratum, with epoxy adhesive layer, copper layer, and photo-lacquer layer

摘要

A performated plastics tape for partly automated mfr. of intermediate members (subcarriers) for semiconductor elements esp. for mfr. of ICs in dual-in-line casings or micropacks for hydrid circuits, comprises a base carrying an epoxy resin adhesive with, on top, a Cu-foil that is coated, on both sideS, with photo-lacquer. On the Cu-side, there are fine structures applied by means of photomasks and photographic techniques. Sn is deposited on the fine structures by galvanic process. The photo-lacquer is removed on the Cu-side; the Cu is etched away in controlled manner, and the photo-lacquer is removed on the underside (of the Cu). Specifically, the plastics tape is perforated according to (German Standard) DIN 15 851, sheet 2, form A.