Monolithic integrated circuit with injection logic part - has epitaxial layer thickness increased in places contg. linear analog circuit parts

摘要

The integrated semiconductor circuit is produced by a planar diffusion process, forming on a common chip an injection logic and a linear analog circuit parts respectively. The integrated circuit contains epitaxial layers of different thickness, produced by a selective and a standard epitaxial process respectively. In the injection logic circuit part results a thinner epitaxial layer, as well as in the insulation and collector zones of the linear analog part. Thicker epitaxial layers are formed in the remaining analog circuit part, preferably over conductive buried layers in the substrate. On the epitaxial layers of different thickness are deposited the remaining regions of both circuit parts by diffusion, or ion implantation.