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BATH AND PROCESS TO ELECTRICALLY REMOVE METAL DEPOSITS, AS SUCH AS COPPER, BRIGHT AND SEMI-BRIGHT NICKEL, SULPHAMATE NICKEL, NICKEL-PHOSPHORUS, CADMIO, CAN, TIN, CHROME AND ALLOY-IRON ALLOYS
BATH AND PROCESS TO ELECTRICALLY REMOVE METAL DEPOSITS, AS SUCH AS COPPER, BRIGHT AND SEMI-BRIGHT NICKEL, SULPHAMATE NICKEL, NICKEL-PHOSPHORUS, CADMIO, CAN, TIN, CHROME AND ALLOY-IRON ALLOYS
An improved electrolytic bath composition and process for stripping metal deposits from a different basis metal comprising an aqueous solution containing activating halogen compounds, an amine, nitro and/or nitrate stripping component, an inhibiting agent to inhibit attack of the basis metal comprising glucoheptonic acid, malic acid, and mixtures thereof, as well as the Group IA, IIA and ammonium salts thereof, and at least one bath soluble compound selected from the group consisting of thiocyanates, oxalates, and mixtures thereof. The stripping of the metal deposit is effected by immersion of the object in the bath while anodically charged and passing electric current through the bath to a cathode for a period of time suffient to achieve the desired magnitude of stripping of the metal deposit.
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