A SELECTIVE PLATING METHOD OF MANUFACTURING PLATED-THROUGH-HOLE PRINTED CIRCUIT BOARDS WITH SOLDER MASK ON BARE COPPER CONDUCTORS AND A PRINTED CIRCUIT BOARD MANUFACTURED THEREBY

摘要

A selective plating method f manufacturing plated through hole printed circuit boards with solder mask on bare copper conductors comprising the following sequence of operations in which is n a double sided copper clad laminate holes are drilled and deburred followed by deposition of electroless copper and flash copper in the hole as well as on the surface of both side foils; pattern resist is printed for plating landing areas only on either or both sides followed by electroplating of copper as per printing of resist carried out in the previous step; protective metal is electroplated followed by stripping the pattern resist printed earlier and the surface is cleaned; ladles conductor patterns printed on either or both the sides of the foils followed by etching of copper from the undesired area; solder mask printed on either or both the sides and cured followed by fusing of tin lead.