A SELECTIVE PLATING METHOD OF MANUFACTURING PLATED-THROUGH-HOLE PRINTED CIRCUIT BOARD WITH SOLDER MASK ON BARE COPPER CONDUCTORS AND A PRINTED CIRCUIT BOARD MANUFACTURED THEREBY

摘要

A selective plating method manufacturing plated through hole printed circuit board, with solder mask on bare copper conductors comprising the following sequence of operations in which a double sided copper clad laminate applied with resist on both the sides, is printed and etched on both the sides and surface cleaned; a resin coat confirming to the base resin is applied in one side; electroless copper is plated on both sides; lacquer is sprayed on the other side of the resin coated side, holes are drilled and deburred followed by deposition of electroless copper in holes and both sides; both sides are sanded to exposed copper pattern for plating, followed by electroplating of copper on the patterns of both sides and in the holes; solder mask is printed on the resin coated side; protective metal is electroplated followed by stripping of lacquer other than the solder mask; light etching is done to remove electroless copper on unwanted areas and printing of solder mask on the other side.