Extruded electronic instrument case - can carry printed circuit cards and be connected in a rack system

摘要

The electronic instrument case (1) is mfd. by the extrusion of a suitable thermo- material in a process which is more economic than conventional alloy injection moulding. The extruded case shells can be cut to the desired length across the profile. The sectional form of the case is designed with slots to allow printed circuit cards to be mounted. The side walls are formed externally so as to allow several units to be connected together laterally or vertically in a block by the use of various sliding clips. Front and rear panels can be screwed to the case. Such cases may be set up in a rack system with edge connector power and signal sockets mounted on the rear panels.