METHOD OF MEASURING RATE OF DEPOSITION OF ELECTROLESS PLATING SOLUTION

摘要

PURPOSE:To determine the rate of deposition of an electroless copper plating soln. and to set an adequate current value easily by applying external current to a copper electrode according to the relations between the external currents while the reaction of the electroless copper plating on said electrode is in progress at prescribed potential and rate of deposition and measuring the polarization induced by the same. CONSTITUTION:A measuring device for the rate of deposition of electroless copper plating solns. consisting of a plating cell 1, a measuring electrode 2, a reference electrode 3, a counter electrode 4, a measuring device 5 for polarization potential, an inverse number operator 6 and a recorder 7 is prepared. Constant current DELTAI is applied to the electrode 4 from the device 5, and the polarization DELTAE induced by the same is measured with the device 5 and the rate Ipl of deposition is calculated. The constant current DELTAI is applied thereto from the outside in accordance with the equation between the external electrode DELTAE and the external current DELTAI while the reaction of electroless copper plating is in progress at the potential Epl and the rate Ipl of deposition. The polarization DELTAE induced by the same is measured and further the rate of deposition of the electroless copper plating soln. is measured.