首页> 外国专利> WORK HOLDER HOLDING APPARATUS IN BOTH-SIDE LAPPING, POLISHING AND FINE GRINDING INCLUDING ELECTRICAL AND CHEMICAL POLISHING

WORK HOLDER HOLDING APPARATUS IN BOTH-SIDE LAPPING, POLISHING AND FINE GRINDING INCLUDING ELECTRICAL AND CHEMICAL POLISHING

机译:双面研磨,抛光和精细研磨中的工件夹持器,包括电和化学抛光

摘要

PURPOSE:To enable the processing of an ultra-thin object to be processed, by simultaneously holding a work holder of a both-side lapping machine or the like by an outside holding apparatus and an inside holding apparatus. CONSTITUTION:The upper plate 4 of a both-side lapping machine, a polishing machine and a fine grinding machine including electrical and chemical polishing polishes the upper surface of an object 6 to be processed by the rotary and the presssing actions of an upper drive shaft 5 and the lower plate 7 polishes the under surface of the object 6 to be processed by the rotation and the pressure of a lower drive shaft 8. In this case, the work holder 1 of the object 6 to be processed is held by drawing force of an outside holding apparatus 2 as well as held by an inside holding apparatus 3 to make it possible to use the work holder thinner than a conventional one and to enable the processing of an ultra-thin object to be processed.
机译:目的:通过用外部保持装置和内部保持装置同时保持双面研磨机等的工件保持架,从而能够处理超薄物体。组成:双面研磨机,抛光机和精细研磨机的上板4,包括电抛光和化学抛光,通过上驱动轴的旋转和挤压作用来抛光待加工物体6的上表面如图5所示,下板7通过下部驱动轴8的旋转和压力对被加工物6的下面进行研磨。在这种情况下,被加工物6的工件支架1被拉力保持。通过使外部保持装置2与内部保持装置3保持接触,可以使用比传统的装置更薄的工件保持器,并且可以对超薄物体进行处理。

著录项

  • 公开/公告号JPS5822400A

    专利类型

  • 公开/公告日1983-02-09

    原文格式PDF

  • 申请/专利权人 SHIBAYAMA KIKAI KK;

    申请/专利号JP19810119242

  • 发明设计人 HATANO KOUICHI;ISHIMURA YOSHIO;

    申请日1981-07-31

  • 分类号C23F3/00;C25F3/16;C25F7/00;

  • 国家 JP

  • 入库时间 2022-08-22 11:46:57

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