METHOD FOR PREPARING A BATH FOR ELECTROLYTIC DEPOSITION OF DUCTILE, GLOSSY COPPER, AND USE OF THE BATH PREPARED FOR ELECTROLYTIC COATING OF A DUCTILE, GLOSSY COPPER LAYER ON A SUBSTRATE.

摘要

1313197 Electro-deposition of copper UDYLITE CORP 17 Dec 1970 [12 Feb 1970] 59982/70 Heading C7B Copper is electro-deposited from an aqueous, acidic plating bath containing a brightening amount of a quaternary ammonium compound obtained by reacting polyethyleneimine with an organic compound capable of quaternizing polyethyleneimine. Various quarternizing agents are listed including benzine chloride, allyl bromide, dimethyl sulphate; and propane sultone; and the agent may be reacted with the polyethyleneimine in an organic solvent, eg dioxane. The bath may also contain a polyether, eg polyglycol, and an organic sulphide having at least one sulphonic group, eg a mercaptan, thiocarbamate or tioxanthate. The bath may be of low copper content, eg down to 7À5 g/l copper. The bath may be used for both plating and refining of copper.