ELECTROPLETION FOR SETTING TEN BLYLLERS ON DIFFERENT SUBSTANCES

摘要

Improved electroplating bath for depositing on substrates bright, tin- lead alloys, wherein soluble tin and lead salts, together with compatible acids, are used in conjunction with a particular combination of additives comprising (1) an aromatic amine, (2) an aromatic aldehyde, (3) an aliphatic aldehyde, and (4) a nonionic surfactant to ensure high speed operations as well as the requisite brightness and leveling. The method of utilizing such electroplating baths to plate substrates with bright metallic tin-lead alloys is also described and claimed.