Cu-Ag base alloy brazing filler material.

摘要

A low-silver Cu-Ag alloy solder having good soldering properties and low vapor pressure, which comprises 5 to 35 % (by weight) of Ag, 2.5 to 13% of Si with the balance Cu and unavoidable impurities. Properties of the solder can be further improved by adding to the above-described fundamental composition at least one component selected from the group consisting of Sn, In, Fe, Ni, Co, B, and Li.