INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED HEATING CIRCUIT, METHOD OF PRODUCING SAME AND METHOD OF SOLDERING BY REFLOW OF SAME

摘要

An integrated circuit package having an auxiliary heating element incorporated therein is described. The integral heating element is accessible for application of electric power from an external source to cause heating of the integral circuit package to a predetermined level at which solder will melt and flow, thereby allowing removal and reinsertion of the integrated circuit package with relationship to associated pins in a support assembly. The integral heating element provides a means for applying controlled heat to the integrated circuit package such that the package can be unsoldered from or soldered to associated electrical interconnection pins, some of which may be hidden from view or physical access.