device for cooling and calibrating extruded tubes or profiles from thermoplastic plastic

• 1. 用于塑料挤出设备的冷却校准装置 [P] . 中国专利： CN100357084C . 2007.12.26
• 2. 用于塑料挤出设备的冷却校准装置 [P] . 中国专利： CN1635946A . 2005-07-06
• 3. device for cooling and calibrating extruded tubes or profiles from thermoplastic plastic [P] . 德国专利： DE2544611C2 . 1989-12-14

  机译： 用于冷却和校准热塑性塑料挤出管材或型材的设备

• 4. device for cooling and calibrating extruded tubes or profiles from thermoplastic plastic [P] . 德国专利： DE000002544611C3 . 1989-12-14

  机译： 用于冷却和校准热塑性塑料挤出管材或型材的设备

• 5. device for cooling and calibrating extruded tubes or profiles from thermoplastic plastic [P] . 德国专利： DE3220837C2 . 1985-05-23

  机译： 用于冷却和校准热塑性塑料挤出管材或型材的设备

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• 2. Thermal stress analysis of calibrating and cooling process for plastic profile in calibrator [C] . Duan Lei, Zhang Yang, Jin Gang, Proceedings of 2016 IEEE International Conference of Online Analysis and Computing Science . 2016
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• 4. Setup of Extruded Cementitious Hollow Tubes as Containing/Releasing Devices in Self-Healing Systems [O] . Alessandra Formia, Salvatore Terranova, Paola Antonaci, 2015
• 5. Improvement of Efficiency of Air Cooling Devices By Creation of Independent Modules with Evolvent Profile Composition of Finned Tubes [O] . Eldar Rinatovich Abdeev, Rail Idiatovich Saitov, Rinat Gazizyanovich Abdeev, 2020
• 6. Spartech Plastics: North American Thermoplastic Extruder Implements Industrial Assessment Findings and Saves More Than $100,000 Per Year [R] . 2005

• 1. 3-D RIGID PLASTIC FEM SIMULATION OF EXTRUDING-BULGING PROCESS OF TEE TUBES [J] . Wang Chenlu ,Shan Debin ,Lu Yan . 中国有色金属学会会刊：英文版 . 1999,第2期
• 2. Air Cooling of Mini-Channel Heat Sink in Electronic Devices [J] . Mousa M. Mohamed ,Mostafa A. Abd El-Baky . 电子器件冷却与温度控制期刊（英文） . 2013,第2期
• 3. Design Methodology for the Micronozzle-Based Electrospray Evaporative Cooling Devices [J] . Hsiu-Che Wang ,Alexander V. Mamishev . 电子器件冷却与温度控制期刊（英文） . 2012,第2期
• 4. Effect of Heat Extraction by Metal Lines and Two Sided Cooling on Temperatures in Organic Light Emitting Diode Based Devices [J] . Deepak . ,Gokaran Nath Shukla . 电子器件冷却与温度控制期刊（英文） . 2011,第3期
• 5. 挤出成型塑料管材冷却过程的建模与温度场数值模拟 [C] . 苏燕 ,陈利民 ,王博 . 2007年全国塑料改性及合金工业技术交流年会 . 2007
• 6. 塑料异型材挤出模数字化设计及定型模内型材的冷却性分析 [A] . 魏聪 . 2018