A lead frame and method in which an adhesive tape strip such as Mylar is rolled or pressed along the undersurface of the lead frame to contact the lead frame and bonding pad undersurfaces. Upon removal of the tags retaining the individual circuit elements to the lead frame, the parts are maintained in their existing orientation and position by the tape strip in conjunction with the lead frame. The circuit elements may then be handled as a unit by means of the lead frame/tape strip combination in subsequent testing, marking, lead bending or other handling operations.
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