METHOD FOR ENCAPSULATION OF ELECTRONIC COMPONENTS BY EXTRUSION OF PLASTIC MATERIAL AND APPLICATIONS FOR THE MANUFACTURE OF LIGHT INDICATORS AND FOR ENCAPSULATION OF ELECTRONIC CIRCUITS

摘要

P ENCAPSULATION OF LIGHT EMITTING DIODES / P P APPLICATION TO THE MANUFACTURE OF LUMINOUS INDICATORS OF A PROCESS FOR ENCAPSULATING N12 ELECTRONIC COMPONENTS PRESENTED IN THE FORM OF A CONTINUOUS BAND 12 AND TO BE FITTED WITH HOUSINGS 13 OF DEFINED FORM, PRODUCED IN AT LEAST ONE PLASTIC MATERIAL 15, PROCESS WHICH, ACCORDING TO THE MAIN REQUEST CONSISTS, BY EXTRUSION USING A HEAD 16 OF EXTRUDER TO GIVE THE PLASTIC MATERIAL 15 THE PROFILE DESIRED FOR THE SAID CASES 13, CHARACTERIZED IN THAT, THE ELECTRONIC COMPONENTS BECAME NO LIGHT EMITTING DIODES, THESE CASES 13 ARE PRODUCED BY COEXTRUSION OF A FIRST TRANSPARENT PLASTIC MATERIAL 35 AND A SECOND PLASTIC MATERIAL OPAQUE 36 LATERALLY AVAILABLE ON SIDE AND OTHER OF THE FIRST MATERIAL TRANSPARENT PLASTIC SO AS TO IMPROVE THE PERFORMANCE OF THE LIGHT INDICATORS THUS OBTAINED. / P P APPLICATION TO THE MANUFACTURE OF LUMINOUS INDICATORS. / P