METHOD OF ENCAPSULATING ELECTRONIC COMPONENTS WITH PLASTIC MATERIAL BY EXTRUSION, AND APPLICATION TO THE PRODUCTION OF ELECTROLUMINESCENT DIODES AND TO THE ENCAPSULATION OF ELECTRONIC CIRCUITS

摘要

Encapsulation of electronic components. Method of encapsulating bare electronic components (11) present in the form of a continuous strip (12) and intended to be provided with envelopes (13, 14) of a defined form made of at least one plastic material (15), characterized in that by extrusion by means of an extrusion head (16) the plastic material (15) is given the profile desired for the said envelopes (13, 14), while the bare electronic components are continuously inserted and immobilized in the said profile, and in that in a final operation common sections of extruded plastic material (15) and of a strip (12) of components are cut so that the bare electronic components (11) thus provided with their envelopes (13, 14) are mutually separated. Application in the manufacture of display elements.