Method of encapsulating electronic components with plastic material by extrusion, and application to the production of electroluminescent diodes and to the encapsulation of electronic circuits

摘要

process for the encapsulation of electronic components. bare (11) in the form of a continuous strip (12), and is intended to be equipped with housings (13, 14) of the fixed form.in at least one plastic material (3), characterized in that,by extrusion using an extruder head (16) is in the plastic material (15) of the profile for the housings (13, 14).while the electronic component is inserted and fixed in a continuous, naked in the profile, and in which, in a final operation.cut portions (15) of common plastic material extruded and tape (12) so as to separate the components of electronic components (11) and naked with their housings (13, 14).