Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance

摘要

A limitation in the use of ceramic substrates for electronic packaging is that photolithographic processes applied to such substrate surfaces do not give the highest resolution that the process is capable of because of inherent surface topographical variations on the ceramic substrate. A smoothing layer of a dry film glazed photosensitive material, such as RISTON solder mask, is laminated over the substrate surface, exposed with UV and cured. Metal conductor lines are then bonded onto the surface of the solder mask layer.