首页> 外国专利> MOLTEN COPPER PLATING METHOD AND COPPER PLATING DEVICE OF STEEL WIRE

MOLTEN COPPER PLATING METHOD AND COPPER PLATING DEVICE OF STEEL WIRE

机译:钢绞线的镀铜方法及镀铜装置

摘要

PURPOSE:To manufacture easily a steel wire having a copper plating layer of a uniform thickness by making the steel wire pass through a molten copper placed in a reducing atmosphere. CONSTITUTION:A molten Cu 11 is put into a plating bath tub 10, its surface is covered with a charcoal powder layer 12, an upper space 17 of the plating bath tub 10 is filled with a non-oxidizing atmosphere by an inert gas or a reducing gas which has been led in from a feed-in hole 18 provided on a Cu plating steel wire leading-out cylindrical body 15, and an O2 content in the molten Cu 11 is set to =30ppm. A steel wire W whose surface has been cleaned by pickling, washing, etc., is made to pass through the molten Cu 11 through a pinch roll 21, an immersing roller 13 and a receiving roller 20, a Cu plating layer of the surface of the steel wire W is solidified by a cooling muffler 19 in an early stage, and the Cu plating layer of a uniform thickness having no biased thickness is formed.
机译:目的:通过使钢丝穿过放置在还原性气氛中的熔融铜,以容易地制造具有均匀厚度的镀铜层的钢丝。组成:将熔融的Cu 11放入电镀浴桶10中,其表面覆盖有木炭粉层12,电镀浴桶10的上部空间17被惰性气体或惰性气体充满非氧化性气氛。从设置在镀铜钢丝引出筒状体15上的导入孔18导入的还原性气体,将熔融Cu 11中的O 2含量设定为≤30ppm。使表面已经通过酸洗,洗涤等清洁过的钢丝W通过夹送辊21,浸没辊13和接收辊20,表面的Cu镀层穿过熔融的Cu 11。然后,通过冷却消声器19使钢丝W早期凝固,形成没有偏厚的均匀厚度的Cu镀层。

著录项

  • 公开/公告号JPS61106759A

    专利类型

  • 公开/公告日1986-05-24

    原文格式PDF

  • 申请/专利权人 FUJIKURA LTD;

    申请/专利号JP19840228553

  • 申请日1984-10-30

  • 分类号C23C2/04;

  • 国家 JP

  • 入库时间 2022-08-22 07:51:29

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