首页> 外国专利> MANUFACTURE OF LEAD-FRAME AND SEMICONDUCTOR DEVICE INCORPORATING SAID LEAD-FRAME

MANUFACTURE OF LEAD-FRAME AND SEMICONDUCTOR DEVICE INCORPORATING SAID LEAD-FRAME

机译:包含所述铅骨架的铅骨架和半导体器件的制造

摘要

PURPOSE:To prevent the penetration of moisture and thereby to improve device reliability by a method wherein sealing by means of resin is accomplished with a synthetic resin thin plate large enough to cover the tab and the ends of inner leads is attached to the side of a pellet which is not to be used for the installation of said pellet. CONSTITUTION:To the sides of inner leads 5a and a tab 3 that will not be used for the installation of the pellet, a synthetic resin thin plate 8, slightly smaller than the area surrounding dams 6 and frames 6a and provided with windows 7whereat tab- supporting leads 4 abut, is attached, by using a epoxy-base adhesive agent. Silver paste 10 is used to attached a pellet 9 to the tab 3 and lines 11 are connected at a low temperature. The portions of the tab-supporting leads 4 positioned within the windows 7 are cut off. Next, the pellet 9 and inner leads 5a are sealed in resin, when the pellet 9 will experience no positional deviation because the tab 3 and the inner leads 5a are fixed with the thin plate 8. When the resin has become cold, the extruding leads 4 and dams 6 are cut off for the forming of leads 5. The tab-supporting leads 4 are thus cut off within the resin, stopping moisture from travelling along the stretch of the leads 4.
机译:用途:为防止水分渗透,从而通过一种方法来提高设备的可靠性,在该方法中,使用合成树脂薄板通过树脂密封,该薄板应足够大以覆盖接线片,并且内部引线的末端应连接到引线的侧面。不用于安装所述颗粒的颗粒。组成:在内部引线5a和不会用于安装小球的接片3的侧面,合成树脂薄板8略小于围堰6和框架6a的周围区域,并设有窗口7,其中接片-通过使用基于环氧的粘合剂将支撑引线4邻接。银浆10用于将粒料9附接到接片3,并且线11在低温下连接。突出部支撑引线4位于窗口7内的部分被切除。接下来,当将小片9和内部引线5a固定在薄板8上时,由于小片9和内部引线5a被薄板8固定,因此当将小块9和内部引线5a密封在树脂中时。为了形成引线5,切断了图4中的孔和坝6。因此,在树脂内切断了凸片支撑引线4,从而阻止了水分沿着引线4的延伸行进。

著录项

  • 公开/公告号JPS61144853A

    专利类型

  • 公开/公告日1986-07-02

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP19840266176

  • 发明设计人 NAKAZAWA HIROSHI;TANIGAWA KIYOUTA;

    申请日1984-12-19

  • 分类号H01L23/50;H01L23/31;H01L23/495;

  • 国家 JP

  • 入库时间 2022-08-22 07:48:40

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