Multi-layeredsubstrate having a fine wiring structure for LSI or VLSI circuits

摘要

Good electrical connection between adjacent metal layers in a multi- layered substrate is provided by embedding a conductive material in via- holes in the insulator which separates the adjacent metal layers. This conductive material can be a low temperature sintered metal such as gold, or a conductive organic paste. The presence of the conductive material avoids problems associated with photoresist material that adheres to the side walls of the via-holes during the metallization process.