Method for producing through-connections in printed circuit boards or multilayer printed circuit boards having inorganic or organic/inorganic insulating layers

摘要

A method is specified for producing through-connections through insulating layers in printed circuit boards or multilayer structures. According to this method, the complete insulating layer is removed in a first step, by means of an ultrasound drilling device, as far as a conductor layer located under the insulating layer. The hole which is produced is subsequently metallised. The method can also be used for making contact with cores of metal-core printed circuit boards. IMAGE